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3nm: Blurring Lines Between SoCs, PCBs And Packages
Leading-edge chipmakers, foundries and EDA companies are pushing into 3nm and beyond, and they are encountering a long list of challenges that raise questions about whether the entire system needs to...
View ArticleChallenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package...
Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet...
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Die-To-Die Stress Becomes A Major Issue
Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout...
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Designing 2.5D Systems
As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional...
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Managing Wafer Retest
Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and...
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MEMS: New Materials, Markets And Packaging
Semiconductor Engineering sat down to talk about future developments and challenges for microelectromechanical systems (MEMS) with Gerold Schropfer, director of MEMS products and European operations in...
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Future Challenges For Advanced Packaging
Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the...
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IC Stresses Affect Reliability At Advanced Nodes
Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together...
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Bump Reliability is Challenged By Latent Defects
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials...
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Fan-Out Panel-Level Packaging Hurdles
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution...
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Silicon Photonics Manufacturing Ramps Up
Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of...
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